Thermal Camera Modules (TCM) project
Biomedical Engineering Department is proud to announce start of the Thermal Camera Modules (TCM) project. First stage contains a “TCM Spark” module, which includes PCBA with a FLIR Lepton camera, a STM32F0 processor and series of interfaces available on the connectors (e.g. USB, UART, CAN). The dedicated PC software that will be able to capture the thermal images, as well as configure the cameras will be released together with the module. Two more modules: “TCM Fire” and “TCM Inferno” with extended functionality will be released in next stages. “Fire” will be equipped with a STM32F7 microcontroller and a 2.4inch TFT display, while “TCM Inferno” will be based on an IMX RT1050 microprocessor, a 4 inch TFT display and CMOS camera. Below, the specification for each module is presented.
TCM SPARK
– FLIR LEPTON sensor,
– STM32F0 microcontroller,
– microUSB connector,
– UART, CAN, SWDIO on ZIF connector
TCM FIRE
– FLIR LEPTON sensor,
– STM32F7 microcontroller,
– 256Mb external RAM,
– 2.4 inch TFT display,
– microUSB connector,
– UART, CAN, SWDIO on ZIF connector,
– FreeRTOS support
TCM INFERNO
– FLIR LEPTON sensor,
– IMX RT microprocessor,
– 256Mb external RAM,
– 4 inch TFT display,
– additional CMOS camera,
-UART, CAN, ETHERNET interfaces.